Resist materials for sub-0.5-μm pattern transfer with demagnifying ion projection lithography (IPL)
| Autor: | A. Heuberger, Gerhard Stengl, L. M. Buchmann, G. Stangl, F. Paschke, Hans Loschner, C. Traher, L. Csepregi, E. Hammel, S. Jacob, W. Fallmann, K. P. Muller, E. Cekan |
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| Rok vydání: | 1989 |
| Předmět: |
Materials science
Excimer laser business.industry medicine.medical_treatment Photoablation Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Ion Optics Resist medicine Electrical and Electronic Engineering business Projection (set theory) Lithography Electron-beam lithography Polyimide |
| Zdroj: | Microelectronic Engineering. 9:289-293 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/0167-9317(89)90067-1 |
| Popis: | Different kinds of resist materials were used to prove the high versatility of Ion Projection Lithography (IPL). With standard exposure and developing conditions test structures in the sub-0.5-μm range were obtained routinely. A new dry development process is presented which included helium ion exposure to polyimide and, subsequently, photoablation by an excimer laser. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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