Load-Pull Characterization and Modeling of Chip and Plastic Packaged HBT'S for PCS Amplifier Applications

Autor:	Der-woei Wu, Gregory N. Henderson
Rok vydání:	1995
Předmět:	Electricity generation Materials science business.industry Load modeling Heterojunction bipolar transistor Amplifier Load pull Electrical engineering Electronic engineering Linearity business Chip Characterization (materials science)
Zdroj:	46th ARFTG Conference Digest.
DOI:	10.1109/arftg.1995.327131
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3cbb4ee8001799be6da8a335d2d4d327 https://doi.org/10.1109/arftg.1995.327131 Zobrazit plný text záznamu