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This paper includes discussions concerning the thermal structure and heat dissipation way of high power density LED light source in order to solve the problems such as short life and low reliability which are coursed by the high heat resistance. The software ANSYS is applied to simulate the high power density LED light source. Various chip types, chip arrangements, chip spacing and different interface materials are analyzed and compared in the article. In addition, the key packaging technology of high power density LED light source is researched. The relationship of total power, power density, luminous efficiency and chip package scale are also discussed in order to provide optimized solution for the high power density LED light source. |
