Low Loss NCF Material for High Frequency Device
| Autor: | Kazutaka Honda, Toshihisa Nonaka, Ueno Keiko, Tsuyoshi Ogawa |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Materials science 020206 networking & telecommunications 02 engineering and technology Dielectric 01 natural sciences High productivity Soldering 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Dissipation factor Dielectric loss Wafer Reaction system Composite material Curing (chemistry) |
| Zdroj: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc.2019.00117 |
| Popis: | Low dielectric loss non-conductive film has been developed. The dielectric dissipation factor was 0.006. In the assembly process, non-conductive film afforded both excellent lamination-ability to the bumped wafer and dicing-ability of non-conductive film laminated wafer simultaneously. Furthermore, by changing curing reaction system, it showed high productivity which can form solder joint well without void in non-conductive film for 3 s of the bonding time. In addition, it was confirmed that there was no failure in reliability test. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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