Manufacturing Yield Improvement for Advanced CMOS Technology Middle-of-Line Interconnect with Cobalt Metallization : YE: YieldEnhancement/Learning
| Autor: | S.-C. Fan, P. Jamison, S. Pancharatnam, M. Sankarapandian, R. Xie, C. Waskiewicz, J. Strane, J. Lee, H. Shobha, J. Demarest, C. Peethala, H. Jagannathan, J. Wynne |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). |
| DOI: | 10.1109/asmc57536.2023.10121123 |
| Databáze: | OpenAIRE |
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