Harnessing process variations for optimizing wafer-level probe-test flow
| Autor: | Michael F. Pas, Constantinos Xanthopoulos, Ali Ahmadi, Bob Orr, Amit Nahar, Yiorgos Makris |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Flexibility (engineering) Engineering business.industry Real-time computing Process (computing) Test compression 02 engineering and technology Automatic test pattern generation 01 natural sciences Signature (logic) 020202 computer hardware & architecture Cost reduction Automatic test equipment 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Transceiver business |
| Zdroj: | ITC |
| DOI: | 10.1109/test.2016.7805835 |
| Popis: | We propose a methodology for dynamically selecting an optimal probe-test flow which reduces test cost without jeopardizing test quality. The granularity of this decision is at the wafer-level and is made before the wafer reaches the probe station, based on an e-test signature which reflects how process variations have affected this particular wafer. The proposed method offers flexibility by optimizing test flow per process signature and its implementation is simple and compatible with most commonly used Automatic Test Equipment. Furthermore, unlike static test elimination approaches, whose agility is limited by the relative importance of the permanently dropped tests, the proposed method is capable of exploring test cost reduction solutions which achieve very low test escape rates. Decisions are made by an intelligent system which maps every point in the e-test signature space to the most appropriate probe-test flow. Training of the system seeks to optimize the test flow of each process signature in order to maximize test cost reduction for a given target of test escapes, thereby enabling exploration of the trade-off between test cost reduction and test quality. The proposed method is demonstrated on an industrial dataset of a million devices from a 65nm Texas Instruments RF transceiver. |
| Databáze: | OpenAIRE |
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