Flip-Chip Integration of III-V Chips on Wafer for mmW Applications

Autor:	Alexander S. Efimov, Alexey A. Zaycev, Alexander S. Kurochka, Alexander M. Temnov, Konstantin V. Dudinov, Artem M. Emelianov, Darya D. Korolkova, Anastasia D. Rudina, Yuriy S. Ranzhin
Rok vydání:	2022
Zdroj:	2022 IEEE 8th All-Russian Microwave Conference (RMC).
DOI:	10.1109/rmc55984.2022.10079408
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3ba178b71cafefaf4373c21531bf67a3 https://doi.org/10.1109/rmc55984.2022.10079408 Zobrazit plný text záznamu