Microreplicated CMP pad for RMG and MOL metallization
| Autor: | Changhong Wu, Ja-Hyung Han, Wei-Tsu Tseng, Hong Lin, Yanni Wang, Dinesh Koli, James Aloysius Hagan |
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| Rok vydání: | 2017 |
| Předmět: |
0209 industrial biotechnology
Materials science business.industry Life time Diamond Nanotechnology 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Die (integrated circuit) 020901 industrial engineering & automation engineering Optoelectronics 0210 nano-technology business |
| Zdroj: | 2017 IEEE International Interconnect Technology Conference (IITC). |
| DOI: | 10.1109/iitc-amc.2017.7968954 |
| Popis: | Microreplicated CMP pad is applied to W and Co buff CMP steps for topography and WiDNU reduction of RMG and MOL metallization. This new pad exhibits stable rates and low defectivity over extended life time without the need for diamond conditioner. It also demonstrates reduction in topography built-up at device level and die level, leading to remarkable reduction in topo-related defects for MOL local interconnects. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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