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Automated defect inspection tools have been applied in a variety of applications and have proven to contribute key information to successful defect reduction efforts.1 To effectively and efficiently solve defect problems it is necessary to understand the sensitivity, capture rate, false event rate, and stability of the inspection system. Without understanding these performance parameters the user is less able to differentiate real process deviations from false ones. Consequently, it is more difficult to isolate the defect source, cause, and optimum corrective action. This paper presents a methodology for evaluating automated defect detection performance parameters together with a test vehicle designed to simulate 4 and 16 Mbit circuit density. An example of practical application ofthe methodology ispresented using both the testvehicle described andrepresentative product wafers. Results are presented together with a discussion ofthe benefits and caveats ofusing a standard test vehicle versus product wafers for evaluating automated defect detection performance. |
