| Autor: |
Yuang-Cherng Chiou, Tai-Jia Chen, Rong-Tsong Lee |
| Rok vydání: |
2009 |
| Předmět: |
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| Zdroj: |
International Journal of Machine Tools and Manufacture. 49:470-477 |
| ISSN: |
0890-6955 |
| DOI: |
10.1016/j.ijmachtools.2009.01.002 |
| Popis: |
To finish a chemical vapor deposition (CVD) diamond film surface, composite electro-plating is introduced during the grinding process to sharpen the grinder, a method named as composite electro-plating in-process sharpening (CEPIS). In the grinding process, the grinder for the cathode and the nickel plate for the anode are connected to a DC power supply and immersed in an electrolyte solution containing diamond particles of 10 μm in size so that metal ions with diamond particles are deposited onto the grinder in process to expose fresh sharp grains. Results show that the removal rate of the diamond film increases with increasing current density. The removal rate of the diamond film at a current density of 7.5 ASD is 3.8 times higher than at 0 ASD as in the traditional grinding method. Based on the experimental results of the observations of the coated surface of the grinder and the variations in the coating thickness, a sharpening mechanism for the CEPIS method is deduced. This mechanism allows the coating thickness of the grinder to be increased with grinding time using the CEPIS method. The higher removal capability is achieved due to the higher active grit density. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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Full Text from ScienceDirect