Chip to chip interconnection for system in packaging using Cu stud bump

Autor:	Lim Meng Rong, Foong Chee Seng, Calvin Lo, Navas Khan, Kesvakumar V. C. Muniandy
Rok vydání:	2015
Předmět:	Thermal copper pillar bump Interconnection Materials science chemistry Bumping chemistry.chemical_element Wafer Composite material Chip Engineering physics Copper Die (integrated circuit) Anisotropic conductive adhesive
Zdroj:	2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
DOI:	10.1109/eptc.2015.7412297
Popis:	The current market trend for chip on chip connection is mainly using copper pillar. The copper pillar technology has been around for many years and advances in the copper pillar technology have grown steadily over the past few years. The main issue with copper pillar is the cost. Bumping a single piece of 12 inch wafer will cost approximately above USD100 — 200. The alternative low cost method studied in this paper is by utilizing copper stud bumps with the combination of anisotropic conductive adhesives to create the inter-metallic connection between the top die and the bottom die.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3afe7bda9553b60541d72c45001b3834 https://doi.org/10.1109/eptc.2015.7412297 Zobrazit plný text záznamu