| Autor: |
Timothy P. Kurzweg, J. Repke, Fouad Kiamilev, Barry K. Gilbert, J. Boles, A.J. Davare, C. Windish, J. Kruchowski, M. Kahrs, Xingle Wang, Steven P. Levitan, M. Taufik, A.S.I.I.I. Morris, E. Jackson, A. Bhaduri, Donald M. Chiarulli, José Antônio Baddini Martinez |
| Rok vydání: |
2003 |
| Předmět: |
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| Zdroj: |
IEEE MTT-S International Microwave Symposium Digest, 2003. |
| Popis: |
Signal integrity is of vital importance to high speed interconnects. The 10G system is a 10 Gbit/second optical interconnect with a cross-section bandwidth of over 1T bit/second fabricated on a heterogeneous platform consisting of a multi-chip module, high-speed SiGe and GaAs opto-electronics. We compare lumped and multisegment microstrip models of the transmission lines on the MCM hybrid. We also model the wirebonds using a quasi-static model and a Co-Planar Waveguide (CPW) model for the bump bonds between the GaAs and SiGe substrates. These models are utilized by a behavioral simulator to demonstrate the effects of interconnect components on waveform shape. The results demonstrate convincingly that signal integrity is of critical importance to end-to-end performance measures at high transmission speeds and that incorporating these models is important to behavioral simulation. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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