Defects Investigation in Low-Temperature and Low-Pressure Sintered Silver Thermal Joints for Non-Metalized Semiconductors
| Autor: | Kamil Gorzka, Krzysztof Stojek, Tomasz Falat, Milena Kiliszkiewicz, Danylo Lizanets, Jan Felba |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
business.industry Scanning electron microscope Scattering 020208 electrical & electronic engineering 020206 networking & telecommunications 02 engineering and technology Semiconductor Thermal 0202 electrical engineering electronic engineering information engineering Composite material business Contact area Joint (geology) Layer (electronics) Energy (signal processing) |
| Zdroj: | 2019 42nd International Spring Seminar on Electronics Technology (ISSE). |
| DOI: | 10.1109/isse.2019.8810178 |
| Popis: | Research goal was to detect defects and imperfections of sintered silver layer at thermal joints. Such defects may influence the contact area which lower mechanical strength of the joint with the usual consequence of reducing the heat flow between joined elements. Research obtained different types of layer quality analysis: $X-\text{ray}$ analysis was done to obtain layer imaging, threshold (image binarization)was used for analysis of achieved images, scanning electron microscope imaging in energy dispersive $X-\text{rasy}$ scattering was performed to determine sintered layer surface composition. |
| Databáze: | OpenAIRE |
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