| Autor: |
Fukuzumi Shizu, Yoshinobu Ozaki, Hitoshi Onozeki, Hirokazu Noma, Kazutaka Honda |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc.2017.116 |
| Popis: |
"Molded reflow process" which is novel high productive 3D stacking process has been developed. The process is a serial process of the first step of chip pre-bonding on the wafer, the second step of resin over-molding and the third step of connection by reflow furnace. Molded reflow process provided not only high productivity compared with thermal compression bonding process but also excellent package (PKG) property compared with conventional reflow connection process. In chip on wafer evaluation, it was found that the novel process showed good solder connection and smaller warpage than reflow process. Furthermore, 3D stacking TSV-PKG was also assembled in the novel process. The obtained PKG shows good connection without misalignment of each chip. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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