| Autor: |
B.I. Lee, Dae-Kyeong Kim, Junghyo Bae, Yoon-Cheol Ha, H.G. Lee, T.-H. Ha |
| Rok vydání: |
2005 |
| Předmět: |
|
| Zdroj: |
Materials Science Forum. :2675-2678 |
| ISSN: |
1662-9752 |
| DOI: |
10.4028/www.scientific.net/msf.475-479.2675 |
| Popis: |
With the usage of Al-Cu bimetals to connect aluminum and copper in power distribution systems growing persistently, efforts to mitigate the mechanical, electrical and electrochemical degradation are widely made. The explosive bonding technology has been considered as a countermeasure for the degradation. In this paper, electrochemical analysis and optical microscopic observation are carried out in order to compare the corrosion resistivity of the explosion type bimetal to the commonly used compression type bimetal. In particular, the effect of anions in the interfacial electrolyte on corrosion susceptibility was also investigated. The results show that the explosive bonding technology can prevent the interfacial corrosion caused by the formation of crevices and pits as well as by galvanic potential difference between aluminum and copper. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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