Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Autor:	Min-Ki Kim, Soojeoung Park, Aeni Jang, Hyuekjae Lee, Seungduk Baek, ChungSun Lee, Ilhwan Kim, Jumyong Park, Youngkun Jee, Un-Byoung Kang, Dae-Woo Kim
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00062
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3925321248206de1f5ff2df3bb046a31 https://doi.org/10.1109/ectc51906.2022.00062 Zobrazit plný text záznamu