Photosensitive polyimide application for multi-chip packages

Autor:	Koetsu Tamura, Shinichi Hasegawa, Ken Seino, Kohji Kimbara, Tatsuo Inoue
Rok vydání:	1992
Předmět:	Interconnection Materials science Polymers and Plastics business.industry Organic Chemistry Hardware_PERFORMANCEANDRELIABILITY Substrate (printing) Chip Supercomputer Signal Hardware_INTEGRATEDCIRCUITS Materials Chemistry Optoelectronics Science technology and society business Multi layer Polyimide
Zdroj:	Journal of Photopolymer Science and Technology. 5:385-392
ISSN:	1349-6336 0914-9244
Popis:	This paper introduces the photosensitive polyimide application for the NEC SX-3 Supercomputer. In case of supercomputers, sophisticated packaging technologies are essential to achieve fastest operations as well as to use highest-speed, highly integrated LSIs.Wiring substrate which mounts and interconnects LSIs is the key to back up LSI's higher logical-operations.The high speed interconnection wirings and high density LSI mounting are requested for the substrate.The Multi-Chip Package using Photosensitive Polyimide had been developed to meet these demands.25μm wide, 75μm center-to-center spacings, four signal layers, 6ns/cm signal transmissions on a 225mm square substrate have been achieved by using this photosensitive polyimide multi layer substrate technology.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::391ca1dad9a50e5ddf4273251ad6fbbb https://doi.org/10.2494/photopolymer.5.385 Zobrazit plný text záznamu