Organometallic Chemical Liquid Deposition (OMCLD) of Cu/SiO2 Films for 3D Filling in Microelectronic Applications

Autor:	Olivier Margeat, Jean Baptiste Quoirin, Kilian Piettre, Clément Barriere, Vincent Colliere, Bruno Chaudret, Virginie Latour, Pierre Fau, Christine Anceau
Rok vydání:	2010
Předmět:	Materials science business.industry Composite number Inorganic chemistry chemistry.chemical_element Nanoparticle Chemical reaction Copper chemistry Chemical engineering Microelectronics Deposition (phase transition) Adhesive business Layer (electronics)
Zdroj:	MRS Proceedings. 1249
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-1249-f03-02
Popis:	The copper precursor N,N'-diisopropylacetamidinate has been decomposed at low temperature (80-110°C) in a liquid process under a moderate H2 pressure. Depending on the choice of the solvent, the process leads to a colloidal solution of well controlled copper nanoparticles or the deposition of composite Cu-SiO2 films on the surfaces. The latter layer is highly adhesive to silica surface, behaves as an active seed layer for electroless copper deposition and allows a conformal covering inside deep trenches.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::389986b261063bce87ae602e630157cd https://doi.org/10.1557/proc-1249-f03-02 Zobrazit plný text záznamu Full text from SpringerLink