Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders
| Autor: | Karl Seelig, Amir Hossein Nobari, Mihriban Pekguleryuz, Mehran Maalekian |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
chemistry.chemical_classification Materials science Base (chemistry) Melting temperature Alloy Metallurgy 02 engineering and technology engineering.material Solderability 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Electronic Optical and Magnetic Materials Contact angle chemistry 0103 physical sciences Materials Chemistry engineering Wetting Electrical and Electronic Engineering Wave soldering 0210 nano-technology Supercooling |
| Zdroj: | Journal of Electronic Materials. 46:4076-4084 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-016-5181-2 |
| Popis: | In this study, the effects of Ag, Ni and Bi additions on the melting, solidification, fluidity and wetting behavior of Sn-0.7Cu base solder alloy are studied. The addition of a small amount of Ni reduces the undercooling and improves the feeding distance (fluidity length); however, Ni does not improve the wetting and the spreading performance. The effect of Ni on the fluidity length of Ag-containing Sn-0.7Cu (SAC alloy) is marginal. Bi and Ag both improve wetting performance and also lower the melting temperature; however, they do not improve the fluidity; instead, they reduce the maximum length of fluidity. |
| Databáze: | OpenAIRE |
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