On the mechanics of laser peeling for ultra-thin glasses
| Autor: | Tz-Cheng Chiu, Chi An Hua, Kun Tso Chen, Chun Han Li, Kuo-Shen Chen, Chien Jung Huang, Chih Han Wang, Tian Shiang Yang, Mao Chi Lin, Chang Da Wen |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Laser ablation
Materials science genetic structures Mechanical Engineering Fracture mechanics Material removal 02 engineering and technology Edge (geometry) 021001 nanoscience & nanotechnology Laser eye diseases law.invention Cracking 020303 mechanical engineering & transports 0203 mechanical engineering Mechanics of Materials Residual stress law General Materials Science sense organs Composite material 0210 nano-technology Brittle fracture |
| Zdroj: | Engineering Fracture Mechanics. 163:236-247 |
| ISSN: | 0013-7944 |
| DOI: | 10.1016/j.engfracmech.2016.06.014 |
| Popis: | Laser peeling is a surface defect removal process involving irradiating laser pulses on edges of ultra-thin glasses. Mechanical- or laser-cutting induced edge defects on glass edges are removed by peeling off a thin layer containing the cutting defects. The new edge-surfaces of the glasses are defect-free and much less prone to cracking failure. In this paper the mechanism of this material removal process is investigated. From experimental observations and theoretical calculations, it is shown that the laser glass peeling is a brittle fracture process driven by residual stress associated to glass surface phase change phenomenon, as opposed to the typical laser ablation material removal. A quantitative fracture mechanics model that simulates the laser induced glass peeling process is also presented. |
| Databáze: | OpenAIRE |
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