A Top-Down Fabrication Process for Vertical Hollow Silicon Nanopillars
| Autor: | Long Que, Yuan He, Xiangchen Che |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Fabrication
Materials science Silicon Hybrid silicon laser business.industry Mechanical Engineering chemistry.chemical_element Nanotechnology 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Aspect ratio (image) 0104 chemical sciences Semiconductor chemistry Etching (microfabrication) Optoelectronics Electrical and Electronic Engineering 0210 nano-technology business Nanopillar Microfabrication |
| Zdroj: | Journal of Microelectromechanical Systems. 25:662-667 |
| ISSN: | 1941-0158 1057-7157 |
| DOI: | 10.1109/jmems.2016.2582341 |
| Popis: | Hollow silicon nanopillars (HSiNPs) have been fabricated from a single crystal silicon wafer by a series of standard top–down microfabrication processes, specifically by an ambient temperature Bosch process using the nanosphere beads as the mask. The dimensions of the hollow silicon nanopillars can be tuned with an outer diameter in the range of hundreds of nanometers and inner diameter from 70 to 700 nm. The density of the HSiNPs can be as high as $1.3 \,\, \times \,\, 10^{8}$ /cm2 and their height-to-width aspect ratio can be as high as 20. The ratio of the wall thickness to the outer diameter of the HSiNPs can be tuned from 1/3 to 1/16. This process could be adapted or modified to fabricate hollow nanopillars from different semiconductors, oxides, and metals, thereby offering a generic method for fabricating hollow nanopillars. [2016-0021] |
| Databáze: | OpenAIRE |
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