A deposition technique for the imaging and analysis of protein interactions with metal and semiconductor surfaces

Autor:	C. L. Andrews, David G. Bear, J. A. Panitz
Rok vydání:	1985
Předmět:	chemistry.chemical_classification business.industry Biomolecule Nanotechnology Field emission microscopy Surface tension Field electron emission Adsorption Semiconductor chemistry Transmission electron microscopy Deposition (phase transition) Anatomy business
Zdroj:	Journal of Electron Microscopy Technique. 2:285-292
ISSN:	1553-0817 0741-0581
DOI:	10.1002/jemt.1060020402
Popis:	A new technique for placing biological molecules on metal, insulator, and semiconductor surfaces is described. The procedure requires only 10 p1 of solution containing molecules at a concentration of 0.1-10 pg/ml. The use of a buffer that does not affect metal substrates, the possibility of fixing the molecules in solution prior to deposition, and the ability to minimize surface tension forces during air drying are other features of the new protocol. Simultaneous deposition on TEM grids and highly curved substrates permits biomolecular adsorption on technologically interesting materials to be visual- ized in the transmission electron microscope.
Databáze:	OpenAIRE
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