Hydrophilic direct bonding and debonding of ultrathin glass substrates for high-temperature devices

Autor:	Kai-Yuan Cheng, Meng-Chyi Wu, Kuang-Chien Hsieh, Wei-Fu Wang
Rok vydání:	2020
Předmět:	010302 applied physics Materials science Physics and Astronomy (miscellaneous) General Engineering General Physics and Astronomy Direct bonding 01 natural sciences Surface energy Specific surface energy Annealing (glass) Bonding strength 0103 physical sciences Wafer Composite material
Zdroj:	Japanese Journal of Applied Physics. 59:070901
ISSN:	1347-4065 0021-4922
DOI:	10.35848/1347-4065/ab98d7
Popis:	The direct hydrophilic bonding and debonding of ultrathin glass substrates onto and off from a glass carrier has been investigated, and a methodology is presented to reduce the excessive bonding strength after high-temperature annealing to facilitate the debonding process. It is found that with a preliminary surface conditioning of glasses at 300 °C and 400 °C in vacuum at 1 mbar before bonding, the specific surface energy of bonded wafers after high-temperature annealing for 30 minutes reduces to about 72% and 50% as compared to the control samples that have been surface-conditioned at room temperature instead.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::37659134d1489a018edd0716b440689c https://doi.org/10.35848/1347-4065/ab98d7 Zobrazit plný text záznamu