The mechanics of bondline thickness in balanced sandwich structures
| Autor: | Ee Hua Wong |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010407 polymers
Electronic assemblies Materials science Polymers and Plastics General Chemical Engineering 02 engineering and technology Mechanics 021001 nanoscience & nanotechnology 01 natural sciences Finite element method 0104 chemical sciences Biomaterials Interfacial shear Lap joint Shear (geology) Transverse shear Shear stress Adhesive Composite material 0210 nano-technology |
| Zdroj: | International Journal of Adhesion and Adhesives. 78:4-12 |
| ISSN: | 0143-7496 |
| DOI: | 10.1016/j.ijadhadh.2017.06.003 |
| Popis: | Assuming negligible in-plane stress, non-varying shear stress, and linearly varying transverse stress along the thickness of the adhesive, the closed-form solutions for the interfacial shear and the interfacial peeling stresses in balanced bonded sandwich structures was derived. The nil-shear-stress condition at the free edge of the adhesive was enforced through the use of a decay function. The solutions for the shear and the peel stresses along the interfaces right up to the free edge were validated with the finite element analysis. The solutions were used to investigate (i) the observed increase susceptibility of single lap joints with increase bondline thickness and (ii) the nil report of such susceptibility for electronic assemblies experiencing differential thermal strain. The first investigation was compromised by the inability of the solutions to model the singular stress/strain field at the free-edge of the interfaces. The second investigation revealed a far higher rate of reduction in the magnitudes of the interfacial shear and peeling stresses in structures (electronic assemblies) that experience differential thermal strain than in structures (single lap joints) that experience bending strain. |
| Databáze: | OpenAIRE |
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