Three-Dimensional Flexible-Module Placement for Stacked Three-Dimensional Integration
| Autor: | Tomohiro Noguchi, Omran Hindawi, Mineo Kaneko |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE International Symposium on Circuits and Systems (ISCAS). |
| Databáze: | OpenAIRE |
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