Refined isolation techniques for GaN-based high electron mobility transistors
| Autor: | Chinnamuthan Periasamy, Niketa Sharma, Nidhi Chaturvedi, Sandeep Dhakad |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Mechanical Engineering Transistor Analytical chemistry BCL3 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Ion law.invention Ion implantation Mechanics of Materials Etching (microfabrication) law 0103 physical sciences Isolation techniques General Materials Science Reactive-ion etching 0210 nano-technology High electron |
| Zdroj: | Materials Science in Semiconductor Processing. 87:195-201 |
| ISSN: | 1369-8001 |
| DOI: | 10.1016/j.mssp.2018.05.015 |
| Popis: | This work investigates the Ar+/N+ based ion implantation and Ar based reactive ion etching (RIE) techniques for device isolation. A comparison of ion implantation technique with three ion energies (20/35/65 keV) and 4 energies (20/35/65/160 keV) of Ar+ and N+ with different ion doses for isolation was reported. Use of 4 energy ion implantation provided better isolation. Ar based single and dual step reactive ion etching process was also explored for the mesa isolation of GaN HEMTs. The etch rate increases (44.7%) significantly after mixing of Ar gas directly with BCl3: Cl2 combination. Hence, the Ar addition in the single step etching proved to be more beneficial as compared to the double step etching technique. |
| Databáze: | OpenAIRE |
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