A novel back-shooting inkjet printhead using trench-filling and SOI wafer
| Autor: | C.-H. Cho, Hoon Song, Ki-deok Bae, Yong-Soo Oh, Soonho Baek, Hyuck Lim, Jong-Woo Shin, Yong-Seok Kim, Chang-Soo Lee, K. Kuk, Su-Ho Shin |
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| Rok vydání: | 2004 |
| Předmět: |
Fabrication
Materials science Silicon business.industry Drop (liquid) Nozzle Metals and Alloys chemistry.chemical_element Silicon on insulator Structural engineering Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry Trench Optoelectronics Wafer Electrical and Electronic Engineering business Instrumentation Layer (electronics) |
| Zdroj: | Sensors and Actuators A: Physical. 114:392-397 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/j.sna.2003.12.023 |
| Popis: | A novel thermal inkjet printhead with monolithically fabricated nickel nozzle plate on SOI wafer has been proposed for the first time. A chamber and a restrictor are implemented on the 40 μm thick top silicon layer, and a nozzle plate covering heater layers is monolithically fabricated on them. Unlike the general back-shooters, the inkjet printhead reported here is a kind of back-shooter, which has a chamber and a restrictor with arbitrary shape by utilizing the silicon dioxide etch-stop layers in the bottom and sidewalls of chamber. Moreover, the electroplating process for nozzle, followed by placing the chamber underneath the heater layer, is performed on a planar surface, resulting in more uniform and reliable control of nozzle size. The new design was applied for monochrome inkjet printhead, which has 56 nozzles in two columns with real 600 NPI (nozzle per inch), and showed good performances such as a drop velocity of 12 m/s, a drop volume of 30 pl, and a maximum firing frequency of 12 kHz for single nozzle ejection. From nozzle by nozzle inspection, we observed the uniformity variation of less than 4% in drop speed as well as drop volume. The monolithic fabrication process resulted in a good uniformity and is expected to have superior manufacturing yield to the nozzle assembly process. |
| Databáze: | OpenAIRE |
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