Broadband Fan-out Phased Antenna Array at 28 GHz for 5G Applications
| Autor: | Dapeng Wu, Erik Öjefors, Erik Wiklund, Dragos Dancila, Johanna Hanning, Imran Aziz |
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| Rok vydání: | 2021 |
| Předmět: |
Physics
business.industry 020208 electrical & electronic engineering Astrophysics::Instrumentation and Methods for Astrophysics 020206 networking & telecommunications 02 engineering and technology Chip Embedded Wafer Level Ball Grid Array law.invention Antenna array Horn antenna Optics law Ball grid array 0202 electrical engineering electronic engineering information engineering Dipole antenna Antenna (radio) business Electrical impedance |
| Zdroj: | 2020 50th European Microwave Conference (EuMC). |
| DOI: | 10.23919/eumc48046.2021.9338060 |
| Popis: | In this paper we present a 28 GHz antenna in package (AiP) design for 5G applications. The antenna array is placed in the fan-out region of the eWLB (enhanced Wafer Level Ball Grid Array) package. Separate antenna arrays are used for TX and RX, which are placed on one of the two re-distribution layers (RDL) inside the package. The heatsink required for the chip operation is also used as a horn antenna to improve the design performance. The 4-element dipole array has the impedance bandwidth of almost 6 GHz (24 GHz-30 GHz) and gives a maximum gain of 9.5 dBi. Beam-steering in ± 35 deg is achieved in the azimuthal plane (H-plane) by providing different phases to the dipoles through the chip. |
| Databáze: | OpenAIRE |
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