Application of Digital Image Correlation on Surface Deformation Measurement of Chip on Board Packaging Structure

Autor:	陈凡秀 Chen Fanxiu, 何小元 He Xiaoyuan
Rok vydání:	2010
Předmět:	Microelectromechanical systems On board Substrate (building) Digital image correlation Materials science Thermal Composite material Chip Surface deformation Atomic and Molecular Physics and Optics Thermal expansion
Zdroj:	ACTA PHOTONICA SINICA. 39:2036-2039
ISSN:	1004-4213
DOI:	10.3788/gzxb20103911.2036
Popis:	Aiming at the thermal mismatch caused by different Coefficients of Thermal Expansion(CTE)of each material in Chip on Board(COB),Digital Image Correlation(DIC)is used to measure the thermomechanical coupling effect in COB packaging structures,and effects of different type substrate are compared.The experiment results are compared with both the results of FEM simulations and the theoretical model.Experimental results reveal that DIC can successfully be applied to the analysis of the thermomechanical coupling effect and provide an availability consult to the design of MEMS apparatus.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::361d9ff0226bd542a09dcfb7ebe27f4f https://doi.org/10.3788/gzxb20103911.2036 Zobrazit plný text záznamu