Local Stress Effect Due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC

Autor:	H. Kino, H. Hashiguchi, S. Tanikawa, Y. Sugawara, S. Ikegaya, T. Fukusima, M. Koyanagi, T. Tanaka
Rok vydání:	2015
Předmět:	Materials science Stress effects law Transistor Three-dimensional integrated circuit Adhesive Composite material law.invention
Zdroj:	Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.
DOI:	10.7567/ssdm.2015.ps-2-5
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::35f2b35fab8a2497c900413a8132bf4f https://doi.org/10.7567/ssdm.2015.ps-2-5 Zobrazit plný text záznamu