| Autor: |
Charles P. Todd, Aswin N. Mehta, Omar Diaz de Leon, Daniel Gobled, Kendall S. Wills, James Grund, Rand B. Carawan, Sundari Nagarathnam, Willmar E. Subido, Kartik Ramanujachar, Siva Kolachina, Tim Nagel, Christine Charpentier |
| Rok vydání: |
2001 |
| Předmět: |
|
| Zdroj: |
ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis. |
| ISSN: |
0890-1740 |
| DOI: |
10.31399/asm.cp.istfa2001p0051 |
| Popis: |
Optical waveform probing is a critical component in flipchip diagnostics. There is a dramatic increase in the need for backside silicon probing of non-flipchip packaged devices. The effective way to implement this strategy is to package the die in a BGA carrier that allows backside analysis. Optical waveform probing has been used primarily as a digital waveform timing analysis tool. The capability of optical waveform probers can be extended to failsite isolation and qualitative analog signal analysis. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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