Identification of Seal, Signature and Fingerprint from Malayalam Agreement Documents using Connected Component Analysis
| Autor: | Bipin Nair B J, Anandha Krishna Raj |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 6th International Conference on Computing Methodologies and Communication (ICCMC). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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