Predicting and reducing substrate induced focus error
| Autor: | Brian C. Sapp, Kia S. Low, Nelson Felix, Ian Stobert, Chandrasekhar Sarma, Bernhard R. Liegl, Stephen E. Greco, Timothy A. Brunner, Kourosh Nafisi |
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| Rok vydání: | 2010 |
| Předmět: |
Focus (computing)
Computer science business.industry Flatness (systems theory) Process (computing) Lithography process Layer thickness law.invention Process variation Optics law Hardware_INTEGRATEDCIRCUITS Electronic engineering Process window Wafer Upstream (networking) Photolithography business Lithography |
| Zdroj: | SPIE Proceedings. |
| ISSN: | 0277-786X |
| Popis: | The ever shrinking lithography process window requires us to maximize our process window and minimize tool-induced process variation, and also to quantify the disturbances to an imaging process caused upstream of the imaging step. Relevant factors include across-wafer and wafer-to-wafer film thickness variation, wafer flatness, wafer edge effects, and design-induced topography. We quantify these effects and their interactions, and present efforts to reduce their harm to the imaging process. We also present our effort to predict design-induced focus error hot spots at the edge of our process window. The collaborative effort is geared towards enabling a constructive discussion with our design team, thus allowing us to prevent or mitigate focus error hot spots upstream of the imaging process. |
| Databáze: | OpenAIRE |
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