Development of trilayer mask etching for fabrication of high aspect ratio structures
Autor: | Vladimir Bliznetsov, Kelvin Loh Wei Loong |
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Rok vydání: | 2019 |
Předmět: | |
Zdroj: | 2019 Electron Devices Technology and Manufacturing Conference (EDTM). |
Popis: | We studied etching processes for silicon antireflective coating (SiARC) and spin-on-carbon (SOC) layers which are used in trilayer patterning approach with 193 nm ArF immersion lithography. Etching processes have been performed with novel gas chemistries in industrial ICP chambers. Based on process window study, the processes have been optimized and used for fabrication of high aspect ratio silicon pillars for flat optics devices. |
Databáze: | OpenAIRE |
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