Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices

Autor:	Jagoda A. Dobrzynska, Jan Vobecky, Thomas B. Gradinger, David Guillon, Chiara Corvasce
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:602-609
ISSN:	2156-3985 2156-3950
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::35518bc4306ec1735429d4a94ffbab8f https://doi.org/10.1109/tcpmt.2022.3160102 Zobrazit plný text záznamu