Defects in TiN and TiAIN coatings grown by combined cathodic arc/unbalanced magnetron technology
| Autor: | Wolf-Dieter Münz, T. Hurkmans, D.B. Lewis, S. Creasey, W. V. Ijzendorn, T. Trinh |
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| Rok vydání: | 1995 |
| Předmět: |
endocrine system
Materials science Metallurgy technology industry and agriculture chemistry.chemical_element Substrate (electronics) engineering.material Condensed Matter Physics complex mixtures eye diseases Cathode Surfaces Coatings and Films law.invention Cathodic protection Coating chemistry Chemical engineering law Etching Cavity magnetron Melting point engineering Tin Instrumentation |
| Zdroj: | Vacuum. 46:323-330 |
| ISSN: | 0042-207X |
| Popis: | During the cathodic arc enhanced metal ion etching process of steel substrates droplets are generated on the cathode which deposit on the substrate surface. The concentration of the droplets obviously depends upon the melting point of the target material. The number of droplets is much greater for TiAl than for Ti. The composition of the TiAl droplets also depends on their size. Large droplets tend to have the same composition as the target material, whereas smaller droplets are enriched in Ti. The adhesion of the droplets to the substrate is very poor, certainly below Lc = 20 N. A subsequent coating of the droplet contaminated surface with the unbalanced magnetron leads to growth defects. Nodule-like defects continue to form on the droplet itself, whereas other droplets are expelled from the coating surface during film growth, generating craters and dish-like growth defects. A simple explanation for the self-expulsion mechanism of droplets is given. |
| Databáze: | OpenAIRE |
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