Thermal and mechanical characterization of high performance epoxy systems with extended cure times

Autor: D. Chinn, Sang Beom Shim, J. C. Seferis
Rok vydání: 1996
Předmět:
Zdroj: Journal of Thermal Analysis. 46:1511-1525
ISSN: 1572-8943
0368-4466
DOI: 10.1007/bf01980758
Popis: Five epoxy resins of different chemistry and functionality were cured with DDS (4,4′-diaminodiphenyl sulfone) using 2, 8 and 14 h curecycles. Both Differential Scanning Calorimetry (DSC) and Thermomechanical Analysis (TMA) were used to characterize reaction behavior and cured properties of the resin systems. In addition, static mechanical tests and density measurements were integrated with the thermal characterization methods to correlate resin properties with process time. Flexural three-point bending experiments showed that the resins tended to have higher yield stress and toughness values at extended cure times. The improved mechanical properties could be attributed to the full development of the epoxy molecular structure, in the form of cross-linked networks and molecular rearrangement. These results suggest that extended cure times or high temperature post-curing may be required to obtain the resin's ultimate mechanical properties for high performance composites.
Databáze: OpenAIRE