Effect of Thermal Cycle Temperature Gap on Thermal Fatigue of Metallized Silicon Nitride Substrates for SiC Power Modules
| Autor: | Hiroyuki Miyazaki, Minh Chu Ngo, Kiyoshi Hirao, Manabu Fukushima |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
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