An optimized Ni P seed layer coating method for through glass via (TGV)

Autor:	Yuzhe Chen, Jihua Zhang, Libin Gao, Siyue Zou, Kexin Liang, Zhongzhe Liu, Zhen Fang, Hongwei Chen, Qinyan Ye
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Microelectronic Engineering. 257:111735
ISSN:	0167-9317
DOI:	10.1016/j.mee.2022.111735
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::340c8aaa5ed13a2c31c2ef645c11b8ee https://doi.org/10.1016/j.mee.2022.111735 Zobrazit plný text záznamu Full Text from ScienceDirect