| Autor: |
J.A. Schutt, B.D. Boughton |
| Rok vydání: |
1989 |
| Předmět: |
|
| Zdroj: |
Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium. |
| DOI: |
10.1109/stherm.1989.76059 |
| Popis: |
Summary form only given. A numerical and experimental study has been conducted to evaluate the thermal performance of leadless ceramic chip carrier packages used in hybrid microcircuit applications at Sandia National Laboratories. This was undertaken to develop a modeling technique which can be used for evaluating the steady-state and transient performance of future hybrid microcircuit designs and to investigate the effect of various packaging parameters. A finite-element model of a 40-pad leadless ceramic chip carrier package was developed and tests were conducted to benchmark the model prediction capability. Sufficient detail was included in the model to capture the solder joints between the chip carrier and the alumina substrate. Steady-state tests were performed with a specially designed chip in order to make direct measurements of the chip surface temperature. The steady-state analysis results were in agreement with the test measurements. > |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
