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Ion beam deposition (IBD) is the direct formation of thin films using a low-energy (tens of eV) mass-analyzed ion beam. The process allows depositions in which the energy, isotopic species, deposition rate, defect production, and many other beam and sample parameters can be accurately controlled. This paper will review recent research at ORNL on the IBD process and the effects of deposition parameters on the materials properties of deposited thin films, epitaxial layers, and isotopic heterostructures. A variety of techniques including ion scattering/channeling, cross-sectional transmission electron microscopy, scanning electron microscopy, and Auger spectroscopy has been used for analysis. The fabrication of isotopic heterostructures of 74 Ge and 30 Si will be discussed, as well as the fabrication of metal and semiconductor overlayers on Si and Ge. The use of IBD for low-temperature epitaxy of 30 Si on Si and 76 Ge on Ge will be presented. The use of self-ion sputter cleaning and in situ reactive ion cleaning as methods for preparing single-crystal substrates for epitaxial deposition will be discussed. Examples of IBD formation of oxides and suicides on Si at low temperatures will also be presented. |
