Bumpless Tape Automated Bonding Technology with Rotary-Head Bonder

Autor:	Teruji Inomata, Tsutomu Kawata, Yoichiro Kurita, Hisao Kasuga
Rok vydání:	2002
Předmět:	Engineering drawing Engineering Aluminum electrode business.industry Inner lead bonding Semiconductor device Ultrasonic bonding High productivity Electrode Head (vessel) Optoelectronics Electrical and Electronic Engineering Tape-automated bonding business
Zdroj:	Journal of Japan Institute of Electronics Packaging. 5:166-170
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.5.166
Popis:	Bumpless ILB (Inner Lead Bonding) technology is characterized by the use of ultrasonic bonding method to bond gold plated inner leads directly to the aluminum electrodes of semiconductor device without forming metallic bumps on the electrodes. This paper describes development of high speed bonding technology with bumpless semi-gang ILB method that allows multiple leads to be bonded simultaneously using single-point bounder. High productivity, low cost and short manufacturing cycle times are achieved by this method.
Databáze:	OpenAIRE
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