Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package

Autor:	Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663959
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::32974357557bbf740edf12ae9d53f794 https://doi.org/10.1109/eptc53413.2021.9663959 Zobrazit plný text záznamu