A pure CMOS surface-micromachined integrated accelerometer
| Autor: | R. Tielert, Andreas Hildebrandt, Bernd Mensching, C. Hierold, Thomas Scheiter, Max Steger, Ulrich Na¨her |
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| Rok vydání: | 1996 |
| Předmět: |
Materials science
business.industry Capacitive sensing Metals and Alloys Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Condensed Matter Physics Chip Capacitance Signal Surfaces Coatings and Films Electronic Optical and Magnetic Materials Surface micromachining CMOS Hardware_INTEGRATEDCIRCUITS Optoelectronics Parasitic extraction Electrical and Electronic Engineering business Instrumentation Signal conditioning |
| Zdroj: | Sensors and Actuators A: Physical. 57:111-116 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/s0924-4247(97)80101-x |
| Popis: | A pure CMOS integrated accelerometer has been realized using surface micromachining as the structural technique. The samples are fabricated by a 14-mask 0.8 μm CMOS standard process in a Siemens production line. Only the standard layers of the process (350 nm polysilicon and 600 nm oxide as sacrificial layer) are used to build up the surface-micromachined device. Sensor release and antisticking are also CMOS-compatible. The movement of a seismic mass normal to the chip surface is capacitively detected (open loop) and transformed on chip into a digital output signal by a robust circuit for measuring sub-femtofarad capacitance difference. Parasitics are suppressed on chip. The sensor is designed to measure accelerations up to 50g. A resolution of ± 0.6g, corresponding to a capacitance change of ± 0.1fF, is observed. |
| Databáze: | OpenAIRE |
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