Ultra-Wideband Power Divider Using Multi-Wafer Packaging Technology
| Autor: | Xiang Zeng, P Chang-Chien, Xing Lan, D Eaves, Flavia S. Fong, M Kintis |
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| Rok vydání: | 2011 |
| Předmět: |
Engineering
business.industry Electronic packaging Electrical engineering Integrated circuit Condensed Matter Physics law.invention law Hardware_INTEGRATEDCIRCUITS Electronic engineering Power dividers and directional couplers Wilkinson power divider Wafer Electrical and Electronic Engineering Wideband business Wafer-level packaging Monolithic microwave integrated circuit |
| Zdroj: | IEEE Microwave and Wireless Components Letters. 21:46-48 |
| ISSN: | 1558-1764 1531-1309 |
| DOI: | 10.1109/lmwc.2010.2091262 |
| Popis: | A compact ultra-wideband Wilkinson power combiner/divider is first demonstrated using a hermetic multi-wafer wafer level packaging technology. Its bandwidth is broadened to around 2-22 GHz with a maximum VSWR around 2:1, by using a multi-section design approach. A total of four sections are adopted to achieve better than 20 dB isolation between output ports across the majority of a 3-19 GHz band. The first two stages are implemented on the first wafer, with the last two stages on the second wafer. This configuration significantly reduces the chip size and volume and makes the multi-section wideband divider viable for monolithic microwave integrated circuit implementation. To the authors' knowledge, this is the smallest Wilkinson power divider ever reported for such a wide bandwidth. |
| Databáze: | OpenAIRE |
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