Low loss and high isolation techniques for high power RF acoustic devices
| Autor: | Masanori Ueda, Osamu Kawachi, Jun Tsutsumi, Tokihiro Nishihara |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
business.industry 020208 electrical & electronic engineering Electrical engineering 020206 networking & telecommunications 02 engineering and technology Heat sink Compensation (engineering) Power (physics) Resonator Transmission (telecommunications) Duplexer 0202 electrical engineering electronic engineering information engineering Insertion loss Radio frequency business |
| Zdroj: | 2016 IEEE MTT-S International Microwave Symposium (IMS). |
| Popis: | Requirements for radio frequency (RF) devices in mobile phones have been getting more stringent, especially in multiband / carrier aggregation systems constructing many RF components. In this paper, we discuss two important items for RF acoustic devices developed by our team. First, we introduce the heat radiation effect and temperature compensation technology to suppress the temperature drift of acoustic devices for lower insertion loss. Heat sink effect of substrates and package, and temperature compensated film bulk acoustic resonator (FBAR) devices employing SiOF is introduced. Then, how to suppress the signal leakage from transmission (Tx) to reception (Rx) of the duplexer using signal cancellation technique is discussed, and SAW Band 8 duplexer is demonstrated as an example. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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