Metallisation patterns for interconnection through holes

Autor:	A.R Burgers, J.H. Bultman, A.C Tip, W.C. Sinke
Rok vydání:	2001
Předmět:	Interconnection Materials science Renewable Energy Sustainability and the Environment Busbar business.industry Optoelectronics Crystalline silicon business FOIL method Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Solar Energy Materials and Solar Cells. 65:347-353
ISSN:	0927-0248
Popis:	ECN has developed a new cell- and module-design for crystalline silicon solar cells called pin-up module (PUM). In this design a limited number of holes (typically 9 or 16) is used to interconnect the front-side metallisation to a foil at the rear side by using pins. In this way the busbars and tabs at the front side are eliminated resulting in several important benefits. The efficiency of the cell becomes independent of the cell area and the efficiency is higher compared to standard tabbed cells. Another benefit is the improved visual appearance. In this paper we discuss the design of the metallisation pattern for the cells. A theoretical analysis is presented that shows the gains of the PUM design over conventional cells.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::31aadeaef258ca271812ab2f10b5645d https://doi.org/10.1016/s0927-0248(00)00112-4 Zobrazit plný text záznamu Full Text from ScienceDirect