Reliability data’s of 0.5μm AlGaN/GaN on SiC technology qualification

Autor: Benoit Lambert, Didier Floriot, C. Gourdon, P. Mezenge, J. Bataille, J. Thorpe, F. Bourgeois, Hervé Blanck, Reza Behtash, Helmut Jung, Bernd Schauwecker, C. Ollivier
Rok vydání: 2012
Předmět:
Zdroj: Microelectronics Reliability. 52:2200-2204
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2012.06.098
Popis: UMS have fully qualified the first AlGAN/GaN on SiC HFET technology in Europe for high RF power applications up to C band. Reliability results presented in this paper demonstrate GH50-10 technology reached a high level of maturity. The qualification procedure includes environmental test, end of life characterisation, definition of the DC and RF Safe Operating Area and a preliminary evaluation of the failure rate. From storage test, a failure mechanism related to the increase of the gate leakage current has been characterised with an activation energy of 2.1 eV. While the manufacturing process has been optimised to prevent the inverse piezoelectric effect, a runaway phenomenon of the drain current was identified to be the wear out mechanism. The activation energy of 1.82 eV leads to a T 50 above 3 × 10 7 h at 175 °C. Robustness test up to a VSWR of |10| were performed. A failure rate of 57 FIT is extracted at 175 °C from more than 200 000 cumulated component hours over 70 devices.
Databáze: OpenAIRE