Piezoresistive properties of diamond like carbon films containing copper
| Autor: | Arvydas Čiegis, Andrius Vasiliauskas, Tomas Tamulevičius, Mindaugas Andrulevičius, K. Šlapikas, Š. Meškinis, Sigitas Tamulevičius, R. Gudaitis |
|---|---|
| Rok vydání: | 2015 |
| Předmět: |
Materials science
Diamond-like carbon Mechanical Engineering Analytical chemistry chemistry.chemical_element General Chemistry Sputter deposition Copper Electronic Optical and Magnetic Materials Carbon film X-ray photoelectron spectroscopy chemistry Sputtering Gauge factor Materials Chemistry Electrical and Electronic Engineering High-power impulse magnetron sputtering |
| Zdroj: | Diamond and Related Materials. 60:20-25 |
| ISSN: | 0925-9635 |
| DOI: | 10.1016/j.diamond.2015.10.007 |
| Popis: | In the present study diamond like carbon films containing copper (DLC:Cu) were deposited by reactive magnetron sputtering. Direct current (DC) sputtering and high power pulsed magnetron sputtering (HIPIMS) were used. The influence of the composition and structure on piezoresistive properties of DLC:Cu films was investigated. Structure of DLC:Cu films was investigated by Raman scattering spectroscopy and transmission electron microscopy (TEM). Chemical composition of the films was studied by using energy-dispersive X-ray spectrometry (EDS) and X-ray photoelectron spectroscopy (XPS). Particularly analysis of XPS O1s spectra revealed oxidation of Cu nanoparticles. Piezoresistive gauge factor of DLC:Cu films was in 3–6 range and decreased with the increase of copper atomic concentration. Tendency of the decrease of the gauge factor of DLC:Cu films with the increased D/G peak area ratio (decreased sp 3 /sp 2 carbon bond ratio) was observed. It was found that resistance (R) of DLC:Cu films decreased with the increase of Cu atomic concentration by logarithmic law. It is shown that a quasilinear increase of piezoresistive gauge factor with log(R) is in good accordance with percolation theory. Temperature coefficient of resistance (TCR) of DLC:Cu films was negative and decreased with copper amount in Cu atomic concentrations ranging up to ~ 40%. Very low TCR values (zero TCR) were observed only for DLC:Cu films with low gauge factor that was close to the gauge factor of the metallic strain gauges. Role of some possible mechanisms: copper amount as well as Cu cluster size on the value of gauge factor is discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect