High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization

Autor:	Xicheng Wei, Dongkai Shangguan, Zhaonian Cheng, Peng Sun, Zonghe Lai, Johan Liu, Cristina Andersson
Rok vydání:	2006
Předmět:	Void (astronomy) Materials science Kirkendall effect Mechanical Engineering Metallurgy Metals and Alloys Intermetallic chemistry.chemical_element engineering.material Microstructure Nickel Coating chemistry Mechanics of Materials Soldering Materials Chemistry engineering Ternary operation
Zdroj:	Journal of Alloys and Compounds. 425:191-199
ISSN:	0925-8388
DOI:	10.1016/j.jallcom.2006.01.080
Popis:	The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-immersion Au metallization exhibited different interfacial morphology after high temperature storage (HTS) testing at 150/spl deg/C. Ni/sub 3/Sn/sub 4/ intermetallic compounds (IMCs) were found in the Sn-Ag system, while in the Sn-Ag-Cu system, spalling grains of (Cu,Ni)/sub 6/Sn/sub 5/ IMC were observed after long aging, along with a thick (Ni,Cu)/sub 3/Sn/sub 4/ IMC layer which adheres to the P rich electroless Ni coating. Kirkendall voids were found between the Sn-Ag and electroless Ni interface after 168 and 500 hour thermal aging, while a clear gap existed at the interface after 1000 hour aging, as a result of the growth of the micro-voids. In the Sn-Ag-Cu system, Kirkendall voids were found inside grains of the Sn-Ni-Cu ternary interfacial compound after 500 and 1000 hour aging.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::310e1da66e705bea19a67929eeca77e9 https://doi.org/10.1016/j.jallcom.2006.01.080 Zobrazit plný text záznamu Full Text from ScienceDirect